Oriented Columnar Structure of a Thin Intermetallic Film Cu6Sn5
Abstract
In this paper, the intermetallic film Cu6Sn5 is investigated, and a new type of highly oriented columnar nanocrystal structure is discovered. Processes of intermetallic compound synthesis in multilayered thin films of Cu-Sn localized in reaction islands with sizes up to 100 nm are examined. Scanning probe microscopy reveals the island structure of the film. A high-temperature phase of Cu6Sn5 with hexagonal lattice is condensed. X-ray structure analysis shows the predominance of single intermetallic phase of Cu6Sn5 while electron microscopy demonstrates high crystallographic orientation of intermetallic phase islands. However, the system of nanocrystals does not seem to be the classical polycrystalline system. The structure of the electronic reflexes suggests that islands of the inter-metallic thin film are deployed at different angles around a crystallographic axis [100]. It has a significant copper orienting effect on the growth of the intermetallic phase Cu6Sn5, orienting it toward [111].Downloads
Metrics
References
McCormack M., Jin Improved S. Mechanical Properties in New, Pb-Free Solder Alloys // Journal of Electronic Materials. - 1994. - Vol. 23, No.8.
Xiao W., Shi Y, Lei Y, Xia Z., Guo F. Comparative Study of Microstructures and Properties of Three Valuable SnAgCuRE Lead-Free Solder Alloys // Journal of Electronic Materials. - 2006. - Vol. 35, No.5.
Bertheau J., Hodaj F., Hotellier N., Charbonnier J. Effect of intermetallic compound thickness on shear strength of 25 mkm diameter Cupillars // Intermetallics. - 2014. - Vol. 51.
Yoon J.-W., Kim S.-W., Koo J.-M. Reliability Investigation and Interfacial Reaction of Ball-Grid-Array Packages Using the Lead-Free Sn-Cu Solder // Journal of Electronic Materials. - 2004. - Vol. 33, No.10.
Zeng G., Xue S., Zhang L., Gao L., Dai W., Luo J. A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substrates // J Mater Sci: Mater Electron. - 2010. - Vol. 21.
Choi W.J., Lee T.Y, Tu K.N., Tamura N., Celestre R.S., MacDowell A.A., Bong Y.Y., Nguyen L. Tin whiskers studied by synchrotron radiation scanning X-ray microdiffraction // Acta Materialia. - 2003. - Vol. 51.
Xu G.-S., Zeng J.-B., Zhou M.-B., Cao S.-S., Ma X., Zhang X.-P. Influence of Soldering Temperature and Dwelling Time on Morphological Evolution of Cu6Sn5 Intermetallic Compound at the Sn-3.0Ag-0.5Cu/Cu Interface // International Conference on Electronic Packaging Technology and High Density Packaging. - 2012.
Choudhury S.F., Ladani L. Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis // Journal of Electronic Materials. - 2014.
Tu K.N. Interdiffusion and reaction in bimetallic Cu-Sn thin films // Acta Metall. - 1973. - Vol. 21, No.4.
Song J.-M., Huang B.-R., Liu C.-Y, Lai Y.-S., Chiu Y-T., Huang T.-W. Nanomechanical responses of intermetallic phase at the solder joint interface - Crystal orientation and metallurgical effects // Materials Science and Engineering A. - 2012. - Vol. 534.
Gagliano R.A., Ghosh G., Fine M.E. Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate // Journal of Electronic Materials. - 2002. - Vol. 31, No. 11.
Huh J.Y, Hong K.K., Kim Y.B., Kim K.T Phase field simulations of intermetallic compound growth during soldering reactions // Journal of Electronic Materials. - 2004. - Vol. 33, No.10.
Suh J.O., Tu K.N., Tamura N. A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6Sn5 and cu substrate in solder joints // JOM. - 2006. - Vol. 58, No.6.
Плотников В.А., Макаров С.В., Макрушина А.Н. Структурно-фазовое состояние бинарной тонкопленочной системы Cu-Sn // Фундаментальные проблемы современного материаловедения. - 2014. - № 1.
Izvestiya of Altai State University is a golden publisher, as we allow self-archiving, but most importantly we are fully transparent about your rights.
Authors may present and discuss their findings ahead of publication: at biological or scientific conferences, on preprint servers, in public databases, and in blogs, wikis, tweets, and other informal communication channels.
Izvestiya of Altai State University allows authors to deposit manuscripts (currently under review or those for intended submission to Izvestiya of Altai State University) in non-commercial, pre-print servers such as ArXiv.
Authors who publish with this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License (CC BY 4.0) that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
- Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).